朱福龍

個人基本情況

    朱福龍(Zhu Fulong,Professor广东11选5开奖结果广东11选5开奖结果,男广东11选5开奖结果,1974年生广东11选5开奖结果,江西新干縣人广东11选5开奖结果,華中科技大學機械科學與工程學院博士、教授、博士生導師;19986月于武漢理工大學汽車學院獲學士學位,20036月于華中科技大學工程力學系獲碩士學位,20076月于華中科技大學機械科學與工程學院獲機械工程博士學位, 2007年進入華中科技大學機械科學與工程學院從事教學與科研工作;主要研究方向為:微納制造,微納米力學,微電子封裝可靠性广东11选5开奖结果、微納米測試與測量;近年來主持及參與的項目包括02重大專項子課題、國家自然科學基金、科技部863計劃項目子課題广东11选5开奖结果、國家重點基礎研究發展計劃(973計劃)、航空基金、軍民融合課題、國家電網委托課題等;發表學術論文50余篇(SCI、EI檢索40余篇),獲中國發明專利4項、軟件版權4項,目前被邀請擔任Polymers, Journal of adhesion science and technology、Review of Scientific Instruments、Journal of Electronic Materials, Computational Materials Science, Journal of Modern Optics, Journal of Materials Science: Materials in Electronics, Journal of Applied Physics等國際期刊審稿人。

歡迎機械、力學、材料、物理等相關專業方向同學報考碩士和博士研究生,要求學生勤奮、踏實,富有科研探索和團隊合作精神,主動性強、執行力強、表達能力強广东11选5开奖结果。

主要研究方向

微納制造

微納米力學

微電子封裝可靠性

微納米測試與測量

 

開設課程

特種加工(秋季-本科生)

微電子制造技術(秋季-本科生)

機械制造裝備技術(春季-本科生)

微納制造技術基礎(秋季-研究生)

 

近年的科研項目、專著與論文、專利广东11选5开奖结果、獲獎

 

發表的主要論文(通訊作者*)

[1] Fulong Zhu*, Xinxin Lin, Wei Zhang, Jiajie Fan, Sheng Liu, “Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique”, IEEE Access, v6, p33099-33110, 2018. (SCI, EI, DOI:10.1109/ACCESS. 2018. 2842199)

[2] Yixin Xu, Fulong Zhu*, Miaocao Wang, Xiaojian Liu, Sheng Liu, “Molecular Dynamics Simulation on Grinding Process of Cu-Si and Cu-SiO2 Composite Structures”, in 19th International Conference on Electronic Packaging Technology, ICEPT 2018.

[3] Miaocao Wang, Fulong Zhu, Yixin Xu, Sheng Liu, “Investigation of the differences in nanometric grinding of SiC and Si by molecular dynamics”, in 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, p434-437, 2018. (EI, DOI:10.23919/ICEP. 2018. 8374341)

[4] Yongjun Pan, Fulong Zhu*, Jiajie Fan, Jiaquan Tao, Xinxin Lin, Fengren Wang and Lang Shi, “Investigation of mechanical properties of silicone/phosphor composite used in light emitting diodes package”, Polymers, v10, n2, p195, 2018. (SCI,EI, DOI: 10.3390/polym10020195)

[5] Yongjun Pan, Fulong Zhu*, Xinxin Lin, Jiajie Fan and Sheng Liu, “Comparison of Ultrasonic Wire Bonding Process between Gold and Copper by Nonlinear Structure Analysis”, Journal of Adhesion Science and Technology, v32, n18, p 2007-2018, 2018. (SCI.EI, DOI: 10.1080/01694243.2018.1463651)

[6] Yongjun Pan, Fulong Zhu*, Xinxin Lin, Jiaquan Tao, Liping He, Han Wang, Sheng Liu, “Comparing the copper and gold wire bonding during thermalsonic wire bonding process”, in 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p 240-243, 2016. (EI, DOI: 10.1109/ICEPT. 2016. 7583127)

[7] Yongjun Pan, Fulong Zhu*, Jiajie Fan, Xinxin Lin, Jiaquan Tao and Sheng Liu, “Thermal-mechanical analysis of high power LED packaging during power cycling test”, 2017 18th International Conference on Electronic Packaging Technology, ICEPT 2017, p1-5, 2017. (EI, DOI: 10.1109/ICEPT.2017.8046394)

[8] Yongjun Pan, Fulong Zhu*, Jiajie Fan, Xinxin Lin, Fengren Wang, Lang Shi, Yan Kan and Sheng Liu, “Reliability prediction of LED packaging by fatigue behavior of bonding wire in power cycling accelerated test”, in 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017, p1-4, 2017. (EI, DOI: 10.1109/EPTC.2017.8277431)

[9] Xinxin Lin, Fulong Zhu*, Liping He, Yongjun Pan, Jiaquan Tao, Ke Duan, “Subsurface damage mechanism of wafer thinning process revealed by molecular dynamics simulation”, in 2016 17th International Conference on Electronic Packaging Technology, ICEPT2016, p417-420, 2016 (EI, DOI:10.1109/ICEPT. 2016.7583166).

[10] Zhu Fulong*, Kan Yan, Kan Tang, Sheng Liu, “Investigation of Thermal Properties of Ni-Coated Graphene Nanoribbons Based on Molecular Dynamics Methods”, Journal of Electronic Materials, v46, n8, p.4733-4739, 2017.(SCI,EI, DOI: 10.1007/s11664-017-5542-5)

[11] Liping He, Fulong Zhu*, Yanming Chen, Ke Duan, Xinxin Lin, Yongjun Pan, Jianquan Tao, “Ultrasonic power measurement system based on acousto-optic interaction”, Review of Scientific Instruments, v87, n5, p1-8, 2016.(SCI,EI, DOI: 10.1063/1.4948731)

[12] Liping He, Fulong Zhu*, Yuhong Liu, Sheng Liu, “Investigaton of machining mechanism of monocrystalline silicon in nanometric grinding”, AIP Advances, Vol.7, Issue 5, 2017. (SCI, EI, DOI: 10.1063/1.4983216)

[13] Liping He, Fulong Zhu*,Ke Duan广东11选5开奖结果,Kai Tang, Sheng Liu, “Mechanical response of copper nanowires under torsion”, in 2015 16th International Conference on Electronic Packaging Technology, ICEPT2015, p318-322, 2015. (EI, DOI: 10.1109/ICEPT. 2015. 7236600)

[14] Fulong Zhu*, Hengyou Liao, Kai Tang, Youkai Chen, Sheng Liu, “Molecular dynamics study on the effect of temperature on the tensile properties of single-walled carbon nanotubes with a Ni-coating”, Journal of Nanomaterials, v 2015, 2015(SCI, EI, DOI: 10.1155/2015/767182)

[15] Wei Zhang, Fulong Zhu*, Honghai Zhang, Sheng Liu, “An Adjustable Sensitivity Shadow Moiré Technique for Surface Morphology Measurement”, Journal of Modern Optics, v61, n8, p641-649, 2014. (SCI, EI, DOI: 10.1080/09500340. 2014. 904941)

[16] Wei Zhang, Fulong Zhu*, Yiquan Dai, Hengyou Liao, Shao Song, Honghai Zhang, Sheng Liu, “Warpage measurement of silicon wafers of various bonding areas”, in 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p1164-1167, 2012. ( EI, DOI: 10.1109/ICEPT-HDP.2012.6474814)

[17] Wei Zhang, Fulong Zhu, Shao Song, Honghai Zhang, Sheng Liu, “3-D warpage measurement of silicon wafer”, in 2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce, AIMSEC 2011, p3603-3605,2011. (EI, DOI: 10.1109/AIMSEC.2011.6010064)

[18] Ying Li, Fulong Zhu*, Yanming Chen, Ke Duan, Kai Tang, Sheng Liu, “Analysis of insertion force of electric connector based on FEM”, 2014 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA2014广东11选5开奖结果,p195-198, 2014. (EI, DOI: 10.1109/IPFA.2014.6898160)

[19] Ke Duan, Fulong Zhu*, Kai Tang, Liping He, Yanming Chen, Sheng Liu, “Effect of Chirality and Number of Graphene Layers on the Mechanical Properties of Graphene-Embedded Copper Nanocomposites”, Computational Materials Science, v117, p294-299, 2016.(SCI, EI, DOI: 10.1016/j.commatsci.2016.02.007)

[20] Fulong Zhu*, Ke Duan, Liping He, Kai Tang, Ying Li, Sheng Liu, “Effects of Chirality and Position of Graphene on the Bending Properties of Graphene-Embedded Copper Nanocomposites”, Journal of Nanoscience and Nanotechnology, Vol.17. Issue 5, p3105-3110, 2017 (SCI,EI, DOI: 10.1166/jnn. 2017. 13040)

[21] Ke Duan, Fulong Zhu*, Ying Li, Kai Tang, Sheng Liu, Yanming Chen, “Contact Resistance Investigation of Electrical Connector with Different Shrink Range”, in 2014 15th International Conference on Electronic Packaging Technology, ICEPT2014, p1146-1149, 2014. (EI, DOI:10.1109/ICEPT.2014. 6922846)

[22] Ke Duan, Fulong Zhu*, Mingxiang Chen, Ying Li, Yanming Chen, “Warpage Analysis of DBC Substrate based on Non-contact Shadow Moiré Technology”, 2014 The 15th International Conference on Electronic Packaging Technology, ICEPT2014, p1427-1430,2014.( EI, DOI: 10.1109/ICEPT.2014.6922923)

[23] Kai Tang, Fulong Zhu*, Ying Li, Ke Duan, Sheng Liu, Yanming Chen, “Effect of Defects on Thermal Conductivity of Graphene”, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, p592-595, 2014. ( EI, DOI: 10.1109/ICEPT.2014.6922725)

[24] Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li, Hengyou Liao, Sheng Liu, “Molecular Dynamics Simulation on Thermal Conductivity of Single-Walled Carbon Nanotubes”, 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p583-586, 2013.( EI, DOI: 10.1109/ICEPT.2013.6756538)

[25] Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li, Hengyou Liao , Xiahui Chen, Sheng Liu, “Effect of Vacancy Defects on Thermal Conductivity of Single-walled Carbon Nanotube”, 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC2013, p817-820, p2013. ( EI, DOI: 10.1109/EPTC. 2013.6745835)

[26] Fulong Zhu*, Kai Tang, Ying Li, Ke Duan, Sheng Liu, Yanming Chen, “Heat conduction study across metal/graphene interface by molecular dynamics”, 2014 16th IEEE Electronics Packaging Technology Conference, EPTC2014, p833-836, 2014. ( EI, DOI: 10.1109/EPTC.2014.7028411)

[27] Simin Wang, Xing Chen, Sheng Liu, Fulong Zhu, Xiaogang Liu,  “Estimation of homogenized Young's modulus of silicone/phosphor composite considering random dispersion and size variation of phosphor particles”, Journal of Composite Materials, v50, n14, p1981-1988, 2015. (SCI,EI, DOI:10. 1177/0021998315597992)

[28] Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, “The effect of temperature on compressive mechanical behavior of SWCNT-Ni”, 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, p633-636, 2012. (EI, DOI:10.1109/ICEPT-HDP. 2012. 6474697)

[29] Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, “Compressing Deformation Investigation of Single-Walled Carbon Nanotube Coated with Ni”广东11选5开奖结果,the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, p728-731, 2012. ( EI, DOI:10.1109/EPTC. 2012.6507178)

[30] Youkai Chen, Fulong Zhu, Kai Tang, Ying Li, Hengyou Liao, Sheng Liu, “Mechanical behavior investigation of single-walled carbon nanotubes with one vacancy”, 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p579-582, 2013. (EI, DOI: 10.1109/ICEPT. 2013.6756537)

[31] Youkai Chen, Fulong Zhu*, Kai Tang, Ying Li, Hengyou Liao, Xiahui Chen, Sheng Liu, “Mechanical Properties Investigation of Graphene Coated with Ni”, the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, p756-759,2013.( EI, DOI: 10.1109/EPTC.2013.6745822)

[32] Hengyou Liao, Fulong Zhu*, Sheng Liu, “Mechanical stretching behavior simulation of SWCNT and SWCNT-Ni”, 2011 International Symposium on Advanced Packaging Materials, APM 2011, p85-90, 2011. (EI, DOI: 10.1109/ISAPM.2011.6105677)

[33] Hengyou Liao, Fulong Zhu*, Wei Zhang, Chen Youkai; Song Shao; Liu Sheng, “Tensile behaviors investigation of SWCNT-Ni with vacancies”广东11选5开奖结果,2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p294-297, 2012. (EI, DOI:10.1109/ICEPT-HDP. 2012.6474621)

[34] Hengyou Liao, Fulong Zhu*, Wei Zhang, Chen Youkai; Song Shao; Liu Sheng, “Torsion behavior simulation of Ni-coating SWCNT based on molecular dynamics”. 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, p1155-1158, 2012. (EI, DOI: 10.1109/ICEPT-HDP.2012.6474812)

[35] Shao Song, Fulong Zhu*, Wei Zhang, Sheng Liu, “Warpage measurement of various substrates based on white light shadow Moiré technology”, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011, p389-392, 2011. (EI, DOI:10.1109/IMPACT. 2011.6117161)

[36] Zhaohui Chen, Shengjun Zhou, Zhicheng Lv, Chuan Liu, Xing Chen, Xiao Jia, Ke Zeng, Bin Song, Fulong Zhu, Mingxiang Chen, Xuefang Wang, Honghai Zhang, Sheng Liu, “Expert advisor for integrated virtual manufacturing and reliability for TSV/SiP based modules”, 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011, p1183-1189, 2011. (EI, DOI: 10.1109/ECTC.2011.5898660);

[37] Dan Xie, Honghai Zhang, Sheng Liu, Fulong Zhu, Sheng Tao, “Mechanical Properties Investigation of PMMA PC and PS during Thermal Nanoimprinting”, 2008 4th International Symposium on Precision Mechanical Measurements, v7130, 2008. (EI,DOI: 10.1117/12.819561)

[38] Fulong Zhu*, Shao Song, Wei Zhang, Sheng Liu, “Creep behavior investigation of lead-free solder alloy Sn96.5Ag3Cu0.5”, 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, p195-198, 2010.(EI, DOI: 10.1109/ICEPT.2010.5582445)

[39] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Microstructures and Tensile Properties of a Sn-Cu Lead-free Solder Alloy”, Journal of Materials Science: Materials in Electronics, v17, n5, p379-384, 2006.( SCI, EI, DOI: 10.1007/s10854-006-7474-3)

[40] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “the Effect of Temperature and Strain Rate On the Tensile properties of a Sn99.3Cu0.7(Ni) Lead-free Solder Alloy”, Microelectronic Engineering, v84, n1, p144-150, 2007.( SCI, EI, DOI: 10.1016/j.mee.2006.09.031)

[41] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Effects of Temperature and Strain Rate on Mechanical property of Sn96.5Ag3Cu0.5”, Journal of Alloys and Compounds, v438, n1-2, p100-105, 2007.( SCI, EI, DOI: 10.1016/j.jallcom.2006.08.009)

[42] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, Microstructure and Mechanical Properties Investigation of Lead-free Solder Sn99.3Cu0.7, 2005 6th International Conference on Electronics Packaging Technology, p1-5, 2005.(EI, DOI: 10.1109/ICEPT.2005.1564686)

[43] Fulong Zhu*, Zhiyong Wang, Rongfeng Guan, Honghai Zhang, “Mechanical Properties of a Lead-Free Solder Alloys”, 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, v 2005, p107-112, 2005.( EI, DOI: 10.1109/AGEC.2005.1452326)

[44] ZHU Fu-long*, WANG Zhi-yong, GUAN Rong-feng, WANG Xue-fang, ZHANG Hong-hai, LIU Sheng, “Single Axis Mini-Tester of Mechanical Property for Micro-Specimen”, The 3rd International Symposium on Instrumentation Science and Technology (ISIST2004), Aug.18-22, 2004, Xi’an, China, Vol.3, 0562-0568.ISTP

[45] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Temperature and Strain Rate Behavior of Lead-free Solder Sn96.5Ag3.5”, 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits  (IPFA 2006), p 239-243, 2006.( EI, DOI: 10.1109/IPFA.2006.251038)

[46] Fulong Zhu*, Zhiyong Wang, Rongfeng Guan, Honghai Zhang, Sheng Liu, “Mechanical properties investigation of a SnAg solder”, Proceedings of 2005 International conference on electronics packaging, Tokyo,Japan,April 13-15, 2005, pp.208-213.(ISTP)

[47] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Creep Behaviors of a Lead-free Solder Alloy Sn96.5Ag3.5”, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, p1-6, 2006. ( EI, DOI: 10.1109/ICEPT.2006.359866)

[48] Rongfeng Guan, Fulong Zhu, Zhiyin Gan, Huang Dexiu , Sheng Liu, “Stress birefringence analysis of polarization maintaining optical fibers”, Optical Fiber Technology, v11, n3, p240-254, 2005.(EI, DOI: 10.1016/j.yofte.2004.10.002)

[49] Wang Zhiyong, Zhu Fulong, ZHANG Hong-hai, LIU Sheng, GUAN Rong-feng, “A Six-axis Mechanical Tester for Microspecimens”, The 3rd International Symposium on Instrumentation Science and Technology(ISIST2004), Aug.18-22, 2004, Xi’an, China, Vol.3, 0535-0540.ISTP

[50] Guan Rongfeng, Wang Xuefang, Zhu Fulong, Gan Zhiyin, Liu Sheng, Huang Dexiu, “Study on plasma cleaning and strength of wire bonding”, 2004 International Conference on the Business of Electronic Product Reliability and Liability ( EPRL), p65-71, 2004.( EI,)

[51] Guan Rongfeng, Gan Zhiyin, Zhu Fulong, Liu Sheng, Wang Xuefang, “Anodic bonding study on vacuum micro sealing cavity”, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, p1-4, 2006. (EI, DOI: 10.1109/ICEPT.2006.359851)

[52] 陳四海, 汪殿民, 朱福龍, 徐涌, 易新建. 微型柔性剪切應力傳感器的制作研究. 傳感器技術, 2005(8) , 81-85

[53] 劉文明, 王志勇, 鮑劍斌, 汪學方, 關榮鋒, 朱福龍, 劉勝. 微陀螺儀的真空回流真空封裝工藝研究. 微細加工技術,April ,2006, p61-64.

獲得軟件版權:

1.封裝材料數據庫系統    V1.0 2004SR11907(登記號)

2. MEMS封裝模擬與仿真庫 V1.0 2005SR04366(登記號)

3.基于聲光效應的超聲功率測量系統UPMS V1.0 2018SR475170 (登記號)

4.寧波市電纜隧道滲水紅外檢測系統CTSIS V1.0 2017SR176828 (登記號)

專    利:

發明專利

1. 朱福龍,陳炎明广东11选5开奖结果,何黎平,段科广东11选5开奖结果,潘永軍,陶加全,藺欣欣,“一種超聲波功率測量系統”, 發明專利,專利號:ZL201610165674.0

2. 朱福龍,宋劭,張偉,劉勝广东11选5开奖结果,王志勇,張鴻海广东11选5开奖结果,“一種基于投影莫爾原理的共面度測量系統”广东11选5开奖结果,發明專利,專利號:ZL 201010548868.7

3. 朱福龍,宋劭,張偉广东11选5开奖结果,劉勝广东11选5开奖结果,王志勇广东11选5开奖结果,張鴻海,“一種基于投影莫爾原理的BGA共面度測量系統”, 發明專利,專利號:ZL 201010548877.6

4. 朱福龍,潘永軍广东11选5开奖结果,陶加全,藺欣欣广东11选5开奖结果,何黎平,段科,“一種基于超聲光柵的共面度測量系統”, 發明專利广东11选5开奖结果,專利號:ZL201610103818.5

5. 張鴻海,劉華勇,舒霞云,徐裕力,肖峻峰,朱福龍广东11选5开奖结果广东11选5开奖结果,張豐,王永先.“一種高粘度流體微量噴射點膠裝置”,發明專利,專利號:ZL200710168669.1

實用新型專利

1. 朱福龍,潘永軍,陶加全,藺欣欣,何黎平,段科,“一種基于超聲光柵的共面度測量系統”,實用新型專利广东11选5开奖结果,專利號:ZL2016101038185.X

2.朱福龍,陶加全,潘永軍,藺欣欣,何黎平,段科,“一種軟材料力學性能測量裝置”广东11选5开奖结果,實用新型專利,專利號:ZL201620299523.5

3.朱福龍广东11选5开奖结果,王烽人广东11选5开奖结果,施浪,藺欣欣广东11选5开奖结果,潘永軍广东11选5开奖结果,王淼操广东11选5开奖结果,劉肖劍,徐伊昕广东11选5开奖结果,“一種電纜隧道缺陷無損快速檢測裝置”,實用新型專利广东11选5开奖结果,專利號:ZL201820212440.7

4. 陳炎明广东11选5开奖结果,朱福龍, 何黎平,段科, 潘永軍, 陶加全,藺欣欣广东11选5开奖结果,“一種基于聲光效應的超聲波功率測量系統”,實用新型專利,專利號:ZL201620224313.X

5. 朱福龍,宋劭,張偉,劉勝,“一種利用分形理論優化加熱結構的環境加熱爐”广东11选5开奖结果,實用新型專利,專利號:ZL 201120031410.4

6. 朱福龍,宋劭,張偉,劉勝,“一種用于微電子封裝材料測試的環境加熱爐”广东11选5开奖结果,實用新型專利,專利號:ZL 2011 2 0031369.0

7. 朱福龍,宋劭,張偉,劉勝,王志勇,張鴻海,“一種基于投影莫爾原理的BGA共面度測量系統”, 實用新型專利,專利號:ZL 20102 0612724.9

8. 朱福龍,宋劭,張偉,劉勝,王志勇,張鴻海,“一種基于投影莫爾原理的共面度測量系統”,實用新型專利广东11选5开奖结果广东11选5开奖结果,專利號:ZL 201020612694.1

9. 王志勇广东11选5开奖结果广东11选5开奖结果,劉勝, 張鴻海, 史鐵林, 汪海英, 汪學方, 朱福龍,“一種用于微小樣品的六軸力學性能測量裝置”,實用新型專利,專利號:ZL03237264.7

10. 張鴻海,劉華勇广东11选5开奖结果,舒霞云,徐裕力,肖峻峰,朱福龍,張豐,王永先.“一種高粘度流體微量噴射點膠裝置”, 實用新型專利,專利號:ZL200720088827.8

主持科研項目:

1.項目名稱:關鍵封裝設備、材料應用工程-封裝翹曲測量設備的研發和產業化

   任務來源:國家02重大專項課題(2009ZX02010-041子課題)

   起止年月:2010.01-2012.12

2.項目名稱:碳納米管增強無鉛互連焊點的界面可靠性研究

   任務來源:中央高?;究蒲袠I務費資助項目(2011TS066)

   起止年月:2011.6-2012.12

3.項目名稱:振動對航電產品電連接器的接觸電阻影響分析研究

   任務來源:國防航空基金(20120279004)

   起止年月:2012.10-2014.10

4.項目名稱:微振動條件下航電產品電連接器的接觸可靠性研究

   任務來源:中央高?;究蒲袠I務費資助項目(2013TS023)

   起止年月:2013.6-2014.12

5.項目名稱:基于聲光效應的超聲功率測量技術研究

   任務來源:企業委托研究項目(2011TS066)

   起止年月:2013.6-2014.12

6.項目名稱:第三代半導體封裝和系統失效機理與可靠性快速壽命方法研究--材料模型建立,數據處理方法開發(子課題)

   任務來源:國家863計劃項目子課題

   起止年月:2015.01-2017.12

7. 項目名稱:基于紅外熱像法的電纜隧道缺陷檢測技術研究

   任務來源:國家電網(橫向)

   起止年月:2015. 10-2017.09

8. 項目名稱:含硅通孔結構晶圓減薄中的表面/界面微結構演化研究

   任務來源:國家自然科學基金(面上項目)

   起止年月:2017.01-2020.12

9. 項目名稱:異質微結構表面差異性同步去除與晶圓減薄新原理

   任務來源:國家973項目子課題(2015CB057203)

   起止年月:2015.1-2019.12

10.項目名稱:MEMS微機械陀螺典型微結構的尺度效應研究

   任務來源:國防航空基金(20160279003)

   起止年月:2017.01-2018.12

 

參加科研項目:

1. 項目名稱:氣密MEMS封裝工藝及規范。

   任務來源:國家863計劃項目(2002AA430030)。

   起止年月:2002.12-2003.12

2. 項目名稱:封裝材料特性測試及數據庫

   任務來源:國家863計劃項目MEMS重大專項(2003AA404016)。

   起止年月:2003.6-2004.12

3. 項目名稱:面向石化等重要行業MEMS壓力傳感器制造與實用化研究。

   任務來源:國家863計劃項目(2004AA404221)广东11选5开奖结果。

   起止年月:2004.10-2005.12

4. 項目名稱:低成本、高性能真空熔焊封裝關鍵技術與裝備的研究

   任務來源:國家863計劃項目(2005AA404260)

   起止年月:2005.7-2006.6

5. 項目名稱:基于荷花效應的MEMS功能表面仿生研究

   任務來源:國家自然基金項目(50475137)

   起止年月:2005.01-2007.12

6. 項目名稱:基于電磁流體動力學的金屬焊料微噴射技術的研究

   任務來源:國家自然基金項目(50775087)

   起止年月:2008.01-2010.12

7. 項目名稱:系統級封裝的基礎研究-熱管理與熱應力

   任務來源:國家973項目子課題(2009CB320203)

   起止年月:2009.02-2013.2

8. 項目名稱:汽車胎壓微傳感器及系統

   任務來源:國家863計劃項目子課題

   起止年月:2008.06-2010.12

9. 項目名稱:高密度三維系統封裝關鍵技術研究

   任務來源:國家02重大專項課題(2009ZX02038)

   起止年月:2010.01-2012.12

10. 項目名稱:先進封裝工藝開發及產業化

   任務來源:國家02重大專項課題(2009ZX02024-09)

   起止年月:2010.01-2012.12

11. 項目名稱:基于TSV的三維封裝關鍵技術

   任務來源:國家02重大專項課題

   起止年月:2010.01-2012.12

12. 項目名稱:MEMS器件規模封裝技術基礎研究

   任務來源:國家02重大專項課題

   起止年月:2010.9-2015.09

13.  項目名稱:耐高溫微系統封裝技術

   任務來源:裝發預研基金重點項目

   起止年月:2018.01-2020.12

獲獎情況:

1. 獲獎項目:系統封裝、測試的若干關鍵技術及裝備

   獎項級別:電子信息技術獎(二等),

   授獎部門:中國電子學會

   獲獎年月:2009.12

2. 獲獎項目:系統封裝、測試的若干關鍵技術及裝備

   獎項級別:科技發明一等獎;

   授獎部門:中國物流與采購聯合會

   獲獎年月:2009.11

3. 獲獎項目:高精度一維測試臺結構設計及試驗

   獎項級別:湖北省優秀學士學位論文-指導教師;

   授獎部門:湖北省教育廳、學位辦

   獲獎年月:2009.2

4. 獲獎項目:膠囊內窺鏡的磁導航式運動檢測臺設計

   獎項級別:湖北省優秀學士學位論文-指導教師;;

   授獎部門:湖北省教育廳、學位辦

   獲獎年月:2010.2

5. 獲獎項目:微型膠囊機器人結構設計

   獎項級別:湖北省優秀學士學位論文-指導教師;

   授獎部門:湖北省教育廳、學位辦

   獲獎年月:2012.12

广东11选5开奖结果
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